Introduction

This document defines the FC41D and describes its air interface and hardware interfaces which are connected with your application.

With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides makes it easy to design and set up mobile applications with the module.

Special Mark

Special Mark：

Mark	Definition
*	When an asterisk (*) is used after a function feature,interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin name, AT command, or argument is under development and currently not supported,unless otherwise specified.

Product Concept

General Description

FC41D is a low-power, cost-effective Bluetooth 5.2 and IEEE 802.11b/g/n module, which integrates the hardware and software resources required for Wi-Fi and Bluetooth applications. It can support AP and STA of Wi-Fi connection, and low-power Bluetooth connection. It is very suitable for low-speed applications and data acquisition applications such as home intelligent terminal, industrial application and so on.

FC41D has a built-in Wi-Fi and Bluetooth ultra-high integration microcontroller, which provides the necessary ability to calculate and stable Wi-Fi and Bluetooth connectivity for IoT data terminals. It includes:

• 120 MHz ARM kernel
• 256 KB RAM
• 2/4 MB Flash
• Complies with IEEE 802.11b/g/n and Bluetooth 5.2 standards

Key Features

The following table describes the key features of FC41D.

Key Features:

Features	Details
Power Supply	VBAT Power Supply: Supply voltage range: 3.0--3.6 V Typical supply voltage: 3.3 V
Operating Frequencies	Wi-Fi: 2.412--2.484 GHz Bluetooth: 2.402--2.480 GHz
Wi-Fi Transmission Data Rates	802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 0--MCS 7)
Wi-Fi Transmitting Power	2.4 GHz: 802.11b @ 11 Mbps: 16 dBm 802.11g @ 54 Mbps: 14 dBm 802.11n @ HT20 MCS 7: 13 dBm
Wi-Fi Protocols	IEEE 802.11b/g/n
Wi-Fi Modulations	CCK, BPSK, QPSK,16QAM, 64QAM
Wi-Fi Operation Modes	AP STA
Bluetooth Protocol	Bluetooth 5.2
Bluetooth Operation Mode	BLE
Bluetooth Modulation	GFSK
Wireless Application Interfaces	Main UART: Used for AT command communication, data transmission and firmware upgrade Debug UART: Used for the output of partial logs SPI*: Supports one SPI and master and slave modes
Antenna Interfaces	PCB antenna Coaxial RF connector (Optional) Wi-Fi/Bluetooth antenna interface (ANT_WIFI/BT), 50 Ω impedance (Optional)
Physical Characteristics	Package: LCC Weight: approx. 1.51 g Size: (20.0 ±0.2) mm × (18.0 ±0.2) mm × (2.6 ±0.2) mm
Temperature Ranges	Operating temperature range : -40 °C to +85 °C Storage temperature range1: -45 °C to +95 °C
RoHS	All hardware components are fully compliant with EU RoHS directive

Functional Diagram

The following figure shows a block diagram of FC41D.

NOTE:

FC41D supports PCB antenna by default; Coaxial RF connector and ANT_WIFI/BT are optional.

EVB Kit

Quectel supplies an evaluation board (FC41D TE-B) with accessories to control or test the module. For more details, see *document[1]*.

Application Interfaces

General Description

The FC41D has 27 LCC pins. The following interfaces are described in detail in subsequent chapters:

• Power supply
• Module reset
• Wireless application interfaces
  - UARTs
  - SPI*
• I2C interface*
• PWM interface*
• WAKEUP interface
• Network status indication
• GPIO interfaces*
• ADC interface*
• RF antenna interfaces

Pin Assignment

NOTE:

1. Keep all RESERVED and unused pins open.
2. All GND pins should be connected to ground.

Pin Description

The following tables show the pin description of module.

I/O Parameter Description:

Type	Description
AI	Analog Input
AIO	Analog Input/Output
DI	Digital Input
DIO	Digital Input/Output
DO	Digital Output
OD	Open Drain
PI	Power Input

Pin Description:

Power Supply:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
VBAT	15	PI	Power supply for the module	Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V	It must be provided with sufficient current up to 0.3 A.
GND	1, 3, 16, 27

Reset:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
CEN	9	DI	Resets the module	Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V	Internally pulled up to 3.3 V. Hardware reset; active low.

Main UART:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
MAIN_TXD	20	DO	Main UART transmits	3.3 V
MAIN_RXD	19	DI	Main UART receives	3.3 V

Debug UART:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
DBG_TXD	26	DO	Debug UART transmits	3.3 V	Test points must be reserved.
DBG_RXD	25	DI	Debug UART receives	3.3V	Test points must be reserved.

SPI*:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
SPI_MISO	13	DIO	SPI master input salve output	3.3 V
SPI_MOSI	14	DIO	SPI master output slave input	3.3V
SPI_CLK	17	DIO	SPI clock	3.3V	In master mode, it’s an output signal; in slave mode, it’s an input signal.
SPI_CS	18	DIO	SPI chip select	3.3V	In master mode, it’s an input signal; in slave mode, it’s an output signal.

I2C Interface:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
I2C_SCL	4	OD	I2C serial clock	3.3 V	Requires external pull-up to 3.3 V.
I2C_SDA	5	OD	I2C serial data	3.3V	Requires external pull-up to 3.3 V.

WAKEUP Interface:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
WAKEUP_IN	7	DI	Wakes up the module from deep sleep or standby mode	3.3 V	Rising edge wakeup.
WAKEUP_OUT	8	DO	Wakes up the host	3.3V	Active high.

Indication Interface:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
NET_STATUS	12	DO	Indicates the module's network activity status	3.3 V	Outputs high level when Wi-Fi is connected in STA mode.

PWM Interface:*

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
PWM	11	DO	Pulse width modulation output channel	3.3 V

GPIO Interface:*

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
GPIO1	10	DIO	General-purpose input/output	3.3 V	Wake-up interrupt.
GPIO2	22	DIO	General-purpose input/output	3.3V	Wake-up interrupt.
GPIO3	23	DIO	General-purpose input/output	3.3V	Wake-up interrupt.
GPIO4	24	DIO	General-purpose input/output	3.3V	Wake-up interrupt.

ADC Interface:*

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
ADC	21	AI	General-purpose ADC interface	Voltage range: 0–2.4 V

RF Antenna Interface:

Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
ANT_WIFI/BT	2	AIO	Wi-Fi/Bluetooth antenna interface		50 Ω impedance.

RESERVED Pin:

Pin Name	Pin No.	Comment
RESERVED	6	Keep it open.

Power Supply

The following table shows the definition of power supply and ground pins of FC41D.

Pin Definition of Power Supply and GND Pins:

Pin Name	Pin No.	I/O	Description	Min.	Typ.	Max.	Unit
VBAT	15	PI	Power supply for the module	3.0	3.3	3.6	V
GND	1, 3, 16, 27

FC41D is powered by VBAT, and it is recommended to use a power supply chip that can provide at least 0.3 A output current. To ensure better power supply performance, it is recommended to parallel 22 μF decoupling capacitor, and 1 μF and 100 nF filter capacitor near the module's VBAT pin. Meanwhile, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT line is, the wider it should be.

VBAT reference circuit is shown as below:

After the module VBAT is powered up, keep the CEN pin at high level to realize the automatic startup of the module.

Cut off the power supply of VBAT, the module will automatically execute turn-off procedure.

Reset

Drive CEN low for at least 100 ms and then release it to reset the module.

Pin Definition of Reset Pin:

Pin Name	Pin No.	Description	Comment
CEN	9	Resets the module	Internally pulled up to 3.3 V. Hardware reset; active low

The reference designs for resetting the module are shown below. An open collector driving circuit or a button can be used to control the CEN pin.

The reset timing is illustrated in the following figure.

Wireless Application Interfaces

UARTs

The module provides two UARTs: the main UART and the debug UART. The module is used as DCE (Data Communication Equipment), and is connected in the traditional DCE-DTE (Data Terminal Equipment) mode.

Pin Definition of UARTs:

Pin Name	Pin No.	I/O	Description	Comment
MAIN_TXD	20	DO	Main UART transmits
MAIN_RXD	19	DI	Main UART receives
DBG_TXD	26	DO	Debug UART transmits	Test points must be reserved.
DBG_RXD	25	DI	Debug UART receives

The main UART can be used for AT command communication and data transmission. The default baud rate is 115200 bps, and the maximum baud rate can reach 2 Mbps.

The main UART is also available for firmware upgrade and supports a default baud rate of 921600 bps.

The following is the schematic diagram of the main UART connection between DCE and DTE.

The debug UART supports 115200 bps baud rate by default, and is used for the output of partial logs.

The following is a reference design of debug UART.

SPI*

FC41D provides a SPI that supports both master and slave modes. The maximum clock frequency of the interface can reach 50 MHz in slave mode, and 8 MHz in the master mode.

The pin description of SPI is shown as below:

Pin Definition of SPI:

Pin Name	Pin No.	I/O	Description	Comment
SPI_MISO	13	DIO	SPI master input slave output
SPI_MOSI	14	DIO	SPI master output slave input
SPI_CLK	17	DIO	SPI clock	In master mode, it's an output signal; in slavemode, it's an input signal.
SPI_CS	18	DIO	SPI chip select	In master mode, it's an input signal; in slave mode, it's an output signal.

I2C Interface*

FC41D provides an I2C interface that supports master mode only with maximum clock frequency of 400 kHz and 7-bit addressing. It can be used to connect peripherals such as EEPROM.

Pin Definition of I2C Interface:

Pin Name	Pin No.	I/O	Description	Comment
I2C_SCL	4	OD	I2C serial clock	Requires external pull-up to 3.3 V.
I2C_SDA	5	OD	I2C serial data	Requires external pull-up to 3.3 V.

PWM Interface*

FC41D provides 1 PWM channel by default. The following table shows the pin description of PWM interface.

Pin Definition of PWM Interface:

Pin Name	Pin No.	I/O	Description
PWM	11	DO	Pulse width modulation output channel

WAKEUP Interface

WAKEUP_IN pin can wake up the module from deep sleep mode or standby mode, while WAKEUP_OUT pin can be used to wake up the host.

Pin Definition of WAKEUP Interface:

Pin Name	Pin No.	I/O	Description	Comment
WAKEUP_IN	7	DI	Wakes up the module fromdeep sleep or standby mode	Rising edge wakeup.
WAKEUP_OUT	8	DO	Wakes up the host	Active high.

Network Status Indication

The network indication pin NET_STATUS can drive the network status indicators.

The following table describes the pin definition and logic level changes of NET_STATUS.

Pin Definition of NET_STATUS:

Pin Name	Pin No.	I/O	Description	Comment
NET_STATUS	12	DO	Indicates the module's network activity status.	Outputs high level when Wi-Fi is connected in STA mode.

A reference circuit is shown in the following figure.

GPIO Interfaces*

FC41D provides 4 GPIO interfaces by default. The following table shows the pin description of GPIOs.

Pin Definition of GPIO Interfaces:

Pin Name	Pin No.	I/O	Description	Comment
GPIO1	10	DIO	General-purpose input/output	Wake-up interrupt.
GPIO2	22	DIO	General-purpose input/output	Wake-up interrupt.
GPIO3	23	DIO	General-purpose input/output	Wake-up interrupt.
GPIO4	24	DIO	General-purpose input/output	Wake-up interrupt.

ADC Interface*

The module provides one ADC interface by default, and the voltage range is 0--2.4 V. To improve the accuracy of ADC, surround the trace of ADC with ground.

Pin Definition of ADC Interface:

Pin Name	Pin No.	I/O	Description
ADC	21	AI	General-purpose ADC interface

ADC Features:

Parameter	Min.	Typ.	Max.	Unit
ADC Voltage Range	0	-	2.4	V
ADC Resolution Rate	-	13	-	bit
ADC Sample Rate	-	6	-	MHz

Antenna Interfaces

FC41D provides PCB antenna, coaxial RF connector and ANT_WIFI/BT (stamphole). The coaxial RF connector is not mounted on the module when using PCB antenna or ANT_WIFI/BT. FC41D supports PCB antenna by default;coaxial RF connector and ANT_WIFI/BT are optional.

Operating Frequencies

The operating frequencies of FC41D is shown in the table below:

Operating Frequencies (Unit: GHz):

Mode	Frequency
2.4 GHz Wi-Fi	2.412--2.484
Bluetooth	2.402--2.480

ANT_WIFI/BT Antenna(Optional)

ANT_WIFI/BT pin description is as below:

Antenna Pin Definition:

Pin Name	Pin No.	I/O	Description	Comment
ANT_WIFI/BT	2	AIO	Wi-Fi/Bluetooth antenna interface	50 Ω impedance.

The circuit of RF antenna interface is shown below. In order to achieve better RF performance, it is necessary to reserve LC and π matching circuit. Matching components such as R1, L1, C1, C2, C3 and D1 should be placed as close to the antenna as possible, L1, C1, C2, C3 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF.

RF Routing Guidelines

For user's PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials' dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the
  characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile,adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

For more details about RF layout, see document [2].

Antenna Design Requirements

Antenna Design Requirements:

Type	Requirement
Frequency Ranges (GHz)	2.4 GHz Wi-Fi: 2.412--2.484 Bluetooth: 2.402--2.480
Cable Insertion Loss(dB)	< 1
VSWR	≤ 2
Gain (dBi)	1 (Typ.)
Max. input power (W)	50
Input impedance (Ω)	50
Polarization type	Vertical

RF Connector Recommendation

If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.

U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

The following figure describes the space factor of mated connectors.

For more details, please visithttp://www.hirose.com.

On Board PCB Antenna

On Board PCB Antenna Characteristics:

Parameter	Min.	Typ.	Max.	Unit
Frequency	2400	-	2500	MHz
Impedance	-	50	-	Ω
VSWR	-	-	3	-
Gain	-	-1.81	-	dBi
Efficiency	-	35 %	-	-

When using the PCB antenna on the module, the module should be placed on the side of the motherboard. The distance between the PCB antenna and connectors, vias, traces, copper area and any other metal components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard under the PCB antenna should be designed as a keepout area.

Coaxial RF Connector (Optional)

Receptacle Specifications

The mechanical dimensions of the receptacle provided by the module are as follows.

Major Specifications of the RF Connector:

Item	Specification
Nominal Frequency Range	DC to 6 GHz
Nominal Impedance	50 Ω
Temperature Rating	-40 °C to +85 °C
Voltage Standing Wave Ratio(VSWR)	Meet the requirements of: Max. 1.3 (DC--3 GHz) Max. 1.45 (3--6 GHz)

Antenna Connector Installation

The receptacle mounted on the module accepts two types of mated plugs that will meet a maximum height of 1.2 mm using a Ø 0.81 mm coaxial cable or a maximum height of 1.45 mm utilizing a Ø 1.13 mm coaxial cable.

The following figure shows the dimensions of mated plugs using Ø 0.81 mm coaxial cables.

The following figure illustrates the connection between the receptacle on FC41D and the mated plug using a Ø 0.81 mm coaxial cable.

The following figure illustrates the connection between the receptacle on FC41D and the mated plug using a Ø 1.13 mm coaxial cable.

Assemble Coaxial Cable Plug Manually

The pictures for plugging in a coaxial cable plug is shown below, θ =90° is acceptable, while θ ≠ 90° is not.

The pictures of pulling out the coaxial cable plug is shown below, θ =90° is acceptable, while θ ≠ 90° is not.

Assemble Coaxial Cable Plug with Jig

The pictures of installing the coaxial cable plug with a jig is shown below, θ = 90° is acceptable, while θ ≠ 90° is not.

Recommended Manufacturers of RF Connector and Cable

RF connectors and cables by I-PEX are recommended. For more details,visit https://www.i-pex.com.

Reliability, Radio and Electrical Characteristics

Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table.

Absolute Maximum Ratings:

Parameter	Min.	Max.	Unit
VBAT	-0.3	3.9	V
I/O input voltage	-0.3	3.9	V

Power Supply Ratings

Module Power Supply Ratings:

Parameter	Min.	Typ.	Max.	Unit
VBAT	3.0	3.3	3.6	V

Digital I/O Characteristics

Digital I/O Requirements:

Parameter	Min.	Typ.	Max.	Unit
VIH	High-level Input Voltage	0.7 ×VBAT	VBAT + 0.2	V
VIL	Low-level Input Voltage	-0.3	0.3 ×VBAT	V
VOH	High-level Output Voltage	0.9 ×VBAT	VBAT	V
VOL	Low-level Output Voltage	0	0.1 ×VBAT	V
IiL	Input Leakage Current	-5	5	µA

Power Consumption

Power Consumption in Low Power Modes

Power Consumption in Low Power Modes:

Parameter	Description	Typ.	Unit
Deep sleep mode	AT+QDEEPSLEEP can set the module to deep sleep mode.In this case, the UARTs stop working and software settings are not saved.	8.6	μA
Standby mode	AT+QLOWPOWER can set the module to standby mode.In this case, the UARTs stop working but software settings can be saved.	30	μA
Idle state	Neither Wi-Fi nor Bluetooth does any operation.	22.74	mA

NOTE:

For more information about AT command, please refer to document [4].

Power Consumption in Normal Operating Modes

Power Consumption in Normal Operating Modes:

Parameter	Description	Typ.	Unit
Wi-Fi Scan	Scan in every 2 s	68.59	mA
Wi-Fi Connected	STA mode is ON, but no STA device is connected	74.52	mA
Wi-Fi Connected	SoftAP mode is ON, and 1 STA device is connected	77.11	mA
Wi-Fi Connected	SoftAP mode is ON, and 2 STA devices are connected	77.29	mA
Wi-Fi Connected	SoftAP mode is ON, but no STA device is connected	77.09	mA
Data Transmission	SoftAP mode data transmission	155.29	mA
Data Transmission	STA mode data transmission	147.81	mA
Data Transmission	SoftAP mode + BLE Server mode data transmission	157.56	mA
Data Transmission	STA mode + BLE Server mode data transmission	149.66	mA
Bluetooth Connected	Receives data as Server	28.41	mA
Bluetooth Connected	Transmits data as Server	28.39	mA
Bluetooth Connected	Receives data as Client	23.68	mA
Bluetooth Connected	Transmits data as Client	23.68	mA
RF Non-signaling Mode	802.11b Tx (2.4 GHz) @ 1 Mbps	91	mA
RF Non-signaling Mode	802.11b Tx (2.4 GHz) @ 11 Mbps	92	mA
RF Non-signaling Mode	802.11g Tx (2.4 GHz) @ 6 Mbps	90	mA
RF Non-signaling Mode	802.11g Tx (2.4 GHz) @ 54 Mbps	88	mA
RF Non-signaling Mode	802.11n Tx (2.4 GHz) @ HT20 MCS0	89	mA
RF Non-signaling Mode	802.11n Tx (2.4 GHz) @ HT20 MCS7	88	mA

RF Performances

Wi-Fi Performances

2.4 GHz Wi-Fi Conducted Output Power：

Protocol	Rate	Min. (dBm)	Typ. (dBm)
802.11b	1 Mbps	14	16
802.11b	11 Mbps	14	16
802.11g	6 Mbps	13	15
802.11g	54 Mbps	12	14
802.11n, HT20	MCS 0	12	14
802.11n, HT20	MCS 7	11	13

2.4 GHz Wi-Fi Conducted Receiving Sensitivity:

Protocol	Rate	Typ. (dBm)
802.11b	1 Mbps	-96
802.11b	11 Mbps	-87
802.11g	6 Mbps	-91
802.11g	54 Mbps	-74
802.11n, HT20	MCS 0	-90
802.11n, HT20	MCS 7	-71

2.4 GHz Wi-Fi OTA TRP Test:

Protocol	Rate	Typ. (dBm)
802.11b	1 Mbps	15
802.11b	11 Mbps	15
802.11g	6 Mbps	14
802.11g	54 Mbps	13
802.11n, HT20	MCS 0	13
802.11n, HT20	MCS 7	12

2.4 GHz Wi-Fi OTA TIS Test：

Protocol	Rate	Typ. (dBm)
802.11b	1 Mbps	-94
802.11b	11 Mbps	-85
802.11g	6 Mbps	-88
802.11g	54 Mbps	-71
802.11n, HT20	MCS 0	-86
802.11n, HT20	MCS 7	-66

BLE Performances

BLE Conducted Output Power / Receiving Sensitivity:

Operating Mode	Output Power (Typ.)	Receiving Sensitivity (Typ.)	Unit
BLE (1 Mbps)	6	-95	dBm

ESD Protection

Static electricity occurs naturally and it may damage the module.Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development,production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

ESD Characteristics (Temperature: 25–30 ºC, Humidity: 40 ±5 %):

Tested Interfaces	Contact Discharge	Air Discharge	Unit
VBAT, GND	±4	±8	kV
ANT_WIFI/BT	±4	±8	kV
Other Interfaces	±0.5	±1	kV

Operating and Storage Temperatures

Operating and Storage Temperatures (Unit: ºC):

Parameter	Min.	Typ.	Max.
Operating Temperature Range2	-40	+25	+85
Storage Temperature Range	-45	-	+95

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE:

The package warpage level of the module conforms to the JEITA ED-7306 standard.

Recommended Footprint

NOTE:

Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

Top and Bottom Views

NOTE:

Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing & Packaging

Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module
is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35--60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours ³ in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours.Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

• The module is not stored in Recommended Storage Condition;
• Violation of the third requirement mentioned above;
• Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
• Before module repairing.

5. If needed, the pre-baking should follow the requirements below:

• The module should be baked for 8 hours at 120 ±5 °C;
• The module must be soldered to PCB within 24 hours after the baking,otherwise it should be put in a dry environment such as in a dry cabinet.

NOTE:

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-staticgloves, when touching the modules.

Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil,thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15--0.18 mm.For more details, see document [3].

The recommended peak reflow temperature should be 235--246 ºC, with 246ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Recommended Thermal Profile Parameters:

Factor	Recommended Value
Soak Zone
Ramp-to-soak slope	0--3 °C/s
Soak time (between A and B: 150 °C and 200 °C)	70--120 s
Reflow Zone
Ramp-up slope	0--3 °C/s
Reflow time (D: over 217 °C)	40--70 s
Max. temperature	235--246 °C
Cool-down slope	-3--0 °C/s
Reflow Cycle
Max. reflow cycle	1

NOTE:

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldestspots of solder joints on the PCB should meet theaboverequirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module's shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise,the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours' Neutral Salt Spraytest, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable,although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are notsure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

Packaging Specifications

This chapter describes only the key parameters and process of packaging.All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.

The module adopts carrier tape packaging and details are as follow:

Carrier Tape

Dimension details are as follow:

Carrier Tape Dimension Table (Unit: mm):

W	P	T	A0	B0	K0	K1	F	E
44	32	0.4	18.5	20.5	3	6.8	20.2	1.75

Plastic Reel

Plastic Reel Dimension Table (Unit: mm):

øD1	øD2	W
330	100	44.5

Mounting Direction

Packaging Process

Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

Place the vacuum-packed plastic reel into the pizza box.

Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules.

Appendix References

Reference Documents:

Document Name
[1] Quectel_FC41D_TE-B_User_Guide.
[2]Quectel_RF_Layout_Application_Note
[3]Quectel_Module_SMT_Application_Note
[4] Quectel_FC41D_AT_Commands_Manual

Terms and Abbreviations:

Abbreviation	Description
ADC	Analog-to-Digital Converter
AP	Access Point
ARM	Advanced RISC Machine
BLE	Bluetooth Low Energy
BPSK	Binary Phase Shift Keying
CCK	Complementary Code Keying
DCE	Data Communication Equipment
DTE	Data Terminal Equipment
EEPROM	Electrically Erasable Programmable Read-Only Memory
ESD	Electrostatic Discharge
GFSK	Gauss Frequency Shift Keying
GND	Ground
GPIO	General-Purpose Input/Output
HT	High Throughput
I2C	Inter-Integrated Circuit
I/O	Input/Output
IEEE	Institute of Electrical and Electronics Engineers
IiL	Input Leakage Current
LCC	Leadless Chip Carrier
Mbps	Megabits per second
MCS	Modulation and Coding Scheme
MSL	Moisture Sensitivity Level
OTA	Over The Air
PCB	Printed Circuit Board
PCM	Pulse Code Modulation
PWM	Pulse Width Modulation
QAM	Quadrature Amplitude Modulation
QPSK	Quadrature Phase Shift Keying
RAM	Random Access Memory
RF	Radio Frequency
RoHS	Restriction of Hazardous Substances
RXD	Receive Data (Pin)
SPI	Serial Peripheral Interface
STA	Station
TIS	Total Isotropic Sensitivity
TRP	Total Radiated Power
TVS	Transient Voltage Suppressor
TXD	Transmit Data (Pin)
UART	Universal Asynchronous Receiver/Transmitter
VIH	High-level Input Voltage
VIL	Low-level Input Voltage
Vnom	Normal Voltage Value
VOH	High-level Output Voltage
VOL	Low-level Output Voltage
VSWR	Voltage Standing Wave Ratio

1. Within the operating temperature range, the module's related performance meets IEEE and Bluetooth specifications.↩

2. Within the operating temperature range, the module's related performance meets IEEE and Bluetooth specifications.↩

3. This floor life is only applicable when the environment conform to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.↩

TE-B User Guide

WiFi Development Guide